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Teardown reveals dual heat pipes inside Xperia Z5 smartphones to tame the Snapdragon 810
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Posted on: 6th Sep 2015
Teardown reveals dual heat pipes inside Xperia Z5 smartphones to tame the Snapdragon 810
When Sony announced the Xperia Z5 trio at IFA 2015 earlier this week, some of you may have been a little disappointed by the choice of chipset under the hood. However, a teardown of the Xperia Z5 and Xperia Z5 Premium has revealed that there is no cause for concern as the two devices feature...
Credits: Teardown reveals dual heat pipes inside Xperia Z5 smartphones to tame the Snapdragon 810
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